Thermal microscopy of electronic materials

Title

Thermal microscopy of electronic materials

Authors

Keywords

Thermal microscopy, Failure analysis, Reliability investigations, Fault localization, Heat transport, Thermal conductivity, Heat capacitance, Thermos-elastic, Phase transition, Melting, Glass transition, Thermally induced strain, Thermally induced stress, Thermoelectric, Thermography, Thermometry, Calorimetry, SThM, SJEM, Laser beam techniques

Journal

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Volume 43, Issue -, Pages 163-176

Publisher

Elsevier BV

Online

2015-12-23

DOI

10.1016/j.mssp.2015.12.014