Structural and electrical characterization of CoNiO monolayer as copper diffusion barrier in integrated circuits

Published 2016 View Full Article

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Title
Structural and electrical characterization of CoNiO monolayer as copper diffusion barrier in integrated circuits
Authors
Keywords
Langmuir Blodgett technique, Monolayer diffusion barrier, Biased thermal stress, XRD, C‒V and leakage current characterization
Journal
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume 48, Issue -, Pages 1-8
Publisher
Elsevier BV
Online
2016-03-08
DOI
10.1016/j.mssp.2016.02.022

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