Effect of thermal cycling process parameters on recrystallization kinetics for processing of fine-grained pure copper
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Title
Effect of thermal cycling process parameters on recrystallization kinetics for processing of fine-grained pure copper
Authors
Keywords
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Journal
MATERIALS AND MANUFACTURING PROCESSES
Volume 32, Issue 1, Pages 34-43
Publisher
Informa UK Limited
Online
2016-01-29
DOI
10.1080/10426914.2016.1140190
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