Sequential and Dendrite‐Free Li Plating on Cu Foil Enabled by an Ultrathin Yolk–Shell SiOx/C@C Layer

Title
Sequential and Dendrite‐Free Li Plating on Cu Foil Enabled by an Ultrathin Yolk–Shell SiOx/C@C Layer
Authors
Keywords
-
Journal
Advanced Energy Materials
Volume 13, Issue 17, Pages -
Publisher
Wiley
Online
2023-03-20
DOI
10.1002/aenm.202204075

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