Cu–Cu low-temperature diffusion bonding by spark plasma sintering: Void closure mechanism and mechanical properties
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Title
Cu–Cu low-temperature diffusion bonding by spark plasma sintering: Void closure mechanism and mechanical properties
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume 139, Issue -, Pages 210-223
Publisher
Elsevier BV
Online
2022-10-14
DOI
10.1016/j.jmst.2022.08.031
References
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