Effect of current density during electrodeposition on microstructure and hardness of textured Cu coating in the application of antimicrobial Al touch surface

Title
Effect of current density during electrodeposition on microstructure and hardness of textured Cu coating in the application of antimicrobial Al touch surface
Authors
Keywords
Antimicrobial copper coating, Scratch hardness, Hall–Petch relation, Nano-twins, Aluminium substrate, E. coli
Journal
Publisher
Elsevier BV
Online
2016-07-17
DOI
10.1016/j.jmbbm.2016.07.013

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