Investigation of nano-tribological behaviors and deformation mechanisms of Cu-Ni alloy by molecular dynamics simulation

With the rapid development of micro/nanodevices, it is critical to investigate and disclose the nano-sized tribological properties and deformation mechanisms. This paper aimed to understand nano-tribological behaviours and deformation process of Cu-Ni alloy. The effects of the pressed depth, alloy composition, and sliding distance on friction state, dislocation density, and von-Mises strain stress (VMSS) are comprehensively investigated using molecular dynamics simulation. The results indicate that a larger pressed depth brings about more lattice defects in the pressed region and a higher transverse force, the stacking fault and dislocation density increased rapidly as the Cu content increases, and a longer sliding distance results in more plastic deformation and the number of wear atoms generated. As the pressed depth and sliding distance rise, the plastic deformation and sub-surface damage are aggravated, however, Cu atoms improve the Cu-Ni alloy resistance of deformation. This work can enrich the understanding on the nano-tribological behaviour and deformation mechanism of Cu-Ni alloy during the ultraprecision process.

Automated summary

This paper investigates the nano-tribological behaviors and deformation process of Cu-Ni alloy using molecular dynamics simulation. The effects of pressed depth, alloy composition, and sliding distance on friction state, dislocation density, and von-Mises strain stress are comprehensively studied. The results show that a larger pressed depth leads to more lattice defects and higher transverse force, increasing Cu content enhances stacking fault and dislocation density, and longer sliding distance induces more plastic deformation and wear atoms. Cu atoms improve the deformation resistance of Cu-Ni alloy. This study enriches the understanding of nano-tribological behavior and deformation mechanism of Cu-Ni alloy during the ultraprecision process.