Low Temperature Curable Polyimide for Advanced Package

Title
Low Temperature Curable Polyimide for Advanced Package
Authors
Keywords
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Journal
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY
Volume 29, Issue 3, Pages 379-382
Publisher
Technical Association of Photopolymers, Japan
Online
2016-08-08
DOI
10.2494/photopolymer.29.379

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