Si-gold-glass hybrid wafer bond for 3D-MEMS and wafer level packaging

Published 2016 View Full Article

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Title
Si-gold-glass hybrid wafer bond for 3D-MEMS and wafer level packaging
Authors
Keywords
-
Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 27, Issue 1, Pages 015005
Publisher
IOP Publishing
Online
2016-10-25
DOI
10.1088/0960-1317/27/1/015005

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