4.6 Article

Mechanically induced Cu active sites for selective C-C coupling in CO2 electroreduction

Journal

JOURNAL OF ENERGY CHEMISTRY
Volume 74, Issue -, Pages 198-202

Publisher

ELSEVIER
DOI: 10.1016/j.jechem.2022.07.011

Keywords

Electrochemical CO2 reduction; Nanocavity Cu foil; Mechanically induce; C-C coupling

Funding

  1. National Natural Science Foundation of China [21988101, 21890753, 52142501]
  2. Key Research Program of FrontierSciences of the Chinese Academy of Sciences [QYZDB-SSW-JSC020]
  3. Strategic Priority Research Program of Chinese Acad-emy of Sciences [XDB36030200]
  4. National Key Research and Development Program of China [2018YFA0703400]
  5. BP Alternative Energy International Limited

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This study reports the use of mechanical polishing to create abundant nanocavities on Cu electrode surface, which effectively confines the carbonaceous intermediates and enhances the probability of C-C coupling reaction in CO2RR. The prepared electrode exhibits a high Faradaic efficiency for C2+ products at negative potentials.
Developing a convenient method to endow bulk Cu-based electrode with high activity of electrocatalytic CO2 reduction reaction (CO2RR) to multicarbon (C2+) products is desirable but challenging. Herein, for the first time, we report that mechanical polishing induces highly reactive Cu sites for selective C-C coupling in CO2RR. We find that mechanical polishing could endow Cu foil with abundant nanocavity surface structure, which efficiently confines the carbonaceous intermediates to enhance the probability of C-C coupling reaction. By confining the carbonaceous intermediates with Cu nanocavity, the as-prepared electrode delivers a Faradaic efficiency toward C2+ products of 65.7 % at-1.3 V vs. RHE, which is enhanced up to 1.7 folds compared with that of commercial Cu foil. This work provides a new method to enable Cu foil with high activity of CO2RR to C2+ products. (c) 2022 Science Press and Dalian Institute of Chemical Physics, Chinese Academy of Sciences. Published by ELSEVIER B.V. and Science Press. All rights reserved.

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