Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging
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Title
Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging
Authors
Keywords
Dielectric Loss, Impact Strength, Dynamic Mechanical Analysis, Effective Thermal Conductivity, Volume Resistivity
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 27, Issue 6, Pages 5592-5599
Publisher
Springer Nature
Online
2016-02-06
DOI
10.1007/s10854-016-4464-y
References
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