Hybrid erosive jet micro-milling of sintered ceramic wafers with and without copper-filled through-holes

Published 2016 View Full Article

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Title
Hybrid erosive jet micro-milling of sintered ceramic wafers with and without copper-filled through-holes
Authors
Keywords
Micro-machining, Abrasive particle, Slurry jet, Air jet, Pocket, Sintered ceramic, Planar area, Selective etching, Plated through-holes, Filled vias
Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 230, Issue -, Pages 198-210
Publisher
Elsevier BV
Online
2015-12-02
DOI
10.1016/j.jmatprotec.2015.11.027

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