The Influence of Thermal Conductivity of Die Material on the Efficiency of Hot-Stamping Process

Title
The Influence of Thermal Conductivity of Die Material on the Efficiency of Hot-Stamping Process
Authors
Keywords
cooling behavior, hot stamping, hot-work die steel, numerical simulation, thermal conductivity
Journal
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
Volume 25, Issue 11, Pages 4848-4867
Publisher
Springer Nature
Online
2016-09-19
DOI
10.1007/s11665-016-2332-9

Ask authors/readers for more resources

Reprint

Contact the author

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started