Microfluidic modular heat sink with improved material characteristics towards thermal management of flexible electronics
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Title
Microfluidic modular heat sink with improved material characteristics towards thermal management of flexible electronics
Authors
Keywords
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Journal
APPLIED THERMAL ENGINEERING
Volume 216, Issue -, Pages 119142
Publisher
Elsevier BV
Online
2022-08-11
DOI
10.1016/j.applthermaleng.2022.119142
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