Microfluidic modular heat sink with improved material characteristics towards thermal management of flexible electronics

Title
Microfluidic modular heat sink with improved material characteristics towards thermal management of flexible electronics
Authors
Keywords
-
Journal
APPLIED THERMAL ENGINEERING
Volume 216, Issue -, Pages 119142
Publisher
Elsevier BV
Online
2022-08-11
DOI
10.1016/j.applthermaleng.2022.119142

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