4.6 Article

Ohmic Heating of an Electrically Conductive Food Package

Journal

JOURNAL OF FOOD SCIENCE
Volume 81, Issue 12, Pages E2966-E2976

Publisher

WILEY
DOI: 10.1111/1750-3841.13542

Keywords

inoculated pack; modeling; heating; packaging; pasteurization

Funding

  1. Thailand Research Fund (TRF) [TRG5780285]
  2. Kasetsart Univ. Research and Development Inst. (KURDI), Kasetsart Univ. Bangkok, Thailand
  3. International Publication Scholarship from Graduate School, Kasetsart Univ.
  4. Faculty of Agro-Industry Research Group (Food Process Innovation), Kasetsart Univ.

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Ohmic heating through an electrically conductive food package is a new approach to heat the food and its package as a whole after packing to avoid post-process contamination and to serve consumer needs for convenience. This process has been successfully completed using polymer film integrated with an electrically conductive film to form a conductive package. Orange juice packed in the conductive package surrounded with a conductive medium was pasteurized in an ohmic heater. A mathematical model was developed to simulate the temperature distribution within the package and its surroundings. A 3-D thermal-electric model showed heating uniformity inside the food package while the hot zone appeared in the orange juice adjacent to the conductive film. The accuracy of the model was determined by comparing the experimental results with the simulated temperature and current drawn; the model showed good agreement between the actual and simulated results. An inoculated pack study using Escherichia coli O157:H7 indicated negative growth of viable microorganisms at the target and over target lethal process temperatures, whereas the microorganism was present in the under target temperature treatment. Consequently, our developed ohmic heating system with conductive packaging offers potential for producing safe food.

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