Recovery of Metals from Electronic Waste-Printed Circuit Boards by Ionic Liquids, DESs and Organophosphorous-Based Acid Extraction

The extraction of metals from waste printed circuit boards (WPCBs) with ionic liquids (ILs), Deep Eutectic Solvents (DESs) and organophosphorous-based acid (Cyanex 272) has been presented. The study was undertaken to assess the effectiveness of the application of the new leaching liquids, and the new method of extraction of metals from the leachate and the solid phase with or without the leaching process. Solvent extraction from the liquid leachate phase has been studied in detail with popular ILs, such as tetraoctylphosphonium bromide, {[P-8,P-8,P-8,P-8][Br] and tributyltetradecylphosphonium chloride, [P-4,P-4,P-4,P-14][Cl] using Aqueous Biphasic Systems (ABS) method. Trihexyltetradecylphosphonium bis(2,4,4-trimethylpentyl) phosphinate, [P-6,P-6,P-6,P-14][Cyanex272], ([P-6,P-6,P-6,P-14][BTMPP]), trihexyltetradecylphosphonium thiocyanate, [P-6,P-6,P-6,P-14][SCN], methyltrioctylammonium chloride (Aliquat 336), as well as bis(2,4,4-trimethylpentyl)phosphinic acid (Cyanex 272) were also used in the extraction of metals from the leachate. Two DESs (1) {choline chloride + lactic acid, 1:2} and (2) {choline chloride + malonic acid, 1:1} were used in the extraction of metals from the solid phase. The extraction behavior of metals with DESs was compared with that performed with three new bi-functional ILs: didecyldimethylammonium salicylate, [N-10,N-10,N-1,N-1][Sal], didecyldimethylammonium bis(2-ethylhexyl) phosphate, [N-10,N-10,N-1,N-1][D2EHPA], and didecyldimethylammonium bis(2,4,4-trimethylpentyl) phosphinate, [N-10,N-10,N-1,N-1][Cyanex272]. The [P-6,P-6,P-6,P-14][Cyanex272]/toluene and (Cyanex 272 + diethyl phosphite ester) mixtures exhibited a high extraction efficiency of about 50-90% for different metal ions from the leachate. High extraction efficiency of about 90-100 wt% with the ABS method using the mixture {[P-8,P-8,P-8,P-8][Br], or [P-4,P-4,P-4,P-14][Cl] + NaCl + H2O2 + post-leaching liquid phase} was obtained. The DES 2 revealed the efficiency of copper extraction, E-Cu = 15.8 wt% and silver, E-Ag = 20.1 wt% at pH = 5 from the solid phase after the thermal pre-treatment and acid leaching. The solid phase extraction efficiency after thermal pre-treatment only was (E-Cu = 9.6 wt% and E-Ag = 14.2 wt%). The use of new bi-functional ILs did not improve the efficiency of the extraction of metal ions from the solid phase. Process factors such as solvent concentration, extraction additives, stripping and leaching methods, temperature, pH and liquid/solid as well as organic/water ratios were under control. For all the systems, the selectivity and distribution ratios were described. The proposed extraction processes can represent alternative paths in new technologies for recovering metals from electronic secondary waste.

Automated summary

The study explores the extraction of metals from waste printed circuit boards using ILs, DESs, and organophosphorous-based acid. Different leaching liquids and methods were tested for their effectiveness in metal extraction. Various solvents, DESs, and bi-functional ILs were compared for their extraction efficiency, offering potential paths for metal recovery from electronic waste.