Ultra‐high T g and ultra‐low coefficient of thermal expansion polyimide films based on hydrogen bond interaction
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Title
Ultra‐high
T
g
and ultra‐low coefficient of thermal expansion polyimide films based on hydrogen bond interaction
Authors
Keywords
-
Journal
JOURNAL OF POLYMER SCIENCE
Volume -, Issue -, Pages -
Publisher
Wiley
Online
2022-04-29
DOI
10.1002/pol.20220177
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