Controlling Galvanic Corrosion with Oxalic Acid and Imidazole for Chemical Mechanical Planarization of Cobalt-Copper Interface
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Title
Controlling Galvanic Corrosion with Oxalic Acid and Imidazole for Chemical Mechanical Planarization of Cobalt-Copper Interface
Authors
Keywords
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Journal
ECS Journal of Solid State Science and Technology
Volume 11, Issue 5, Pages 054007
Publisher
The Electrochemical Society
Online
2022-05-07
DOI
10.1149/2162-8777/ac6d72
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Note: Only part of the references are listed.- Experimental and density functional theory study of complexing agents on cobalt dissolution in alkaline solutions
- (2021) Lianjun Hu et al. ELECTROCHIMICA ACTA
- Effect of Diethanolamine as Corrosion Inhibitor for the Chemical Mechanical Polishing of Cobalt in H2O2 Based Slurry
- (2021) Aoxue Xu et al. ECS Journal of Solid State Science and Technology
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- (2020) Tengda Ma et al. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
- Potassium tartrate as a complexing agent for chemical mechanical polishing of Cu/Co/TaN barrier liner stack in H2O2 based alkaline slurries
- (2019) Lianjun Hu et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- A fluorescence and colorimetric dual-mode assay of alkaline phosphatase activity via destroying oxidase-like CoOOH nanoflakes
- (2018) Shi Gang Liu et al. Journal of Materials Chemistry B
- Synthesis, characterization and biological studies of copper oxide nanostructures
- (2018) Saquf Jillani et al. Materials Research Express
- Ammonium Persulfate and Potassium Oleate Containing Silica Dispersions for Chemical Mechanical Polishing for Cobalt Interconnect Applications
- (2018) C. K. Ranaweera et al. ECS Journal of Solid State Science and Technology
- Citric Acid as a Complexing Agent in Chemical Mechanical Polishing Slurries for Cobalt Films for Interconnect Applications
- (2017) R. Popuri et al. ECS Journal of Solid State Science and Technology
- Role of 1,2,4-Triazole in Co/Cu Removal Rate Selectivity and Galvanic Corrosion during Barrier CMP
- (2017) Wenqian Zhang et al. ECS Journal of Solid State Science and Technology
- Potassium Oleate as a Dissolution and Corrosion Inhibitor during Chemical Mechanical Planarization of Chemical Vapor Deposited Co Films for Interconnect Applications
- (2017) R. Popuri et al. ECS Journal of Solid State Science and Technology
- Effect of Chelating Agent on Reducing Galvanic Corrosion between Cobalt and Copper in Alkaline Slurry
- (2016) Xiangzhou Li et al. ECS Journal of Solid State Science and Technology
- Growth and characterization of Sm3+ doped cerium oxalate single crystals
- (2016) Minu Mary C et al. Journal of Materials Research and Technology-JMR&T
- Chemical and Mechanical Aspects of a Co-Cu Planarization Scheme Based on an Alkaline Slurry Formulation
- (2015) M. C. Turk et al. ECS Journal of Solid State Science and Technology
- Inhibition properties and adsorption behavior of imidazole and 2-phenyl-2-imidazoline on AA5052 in 1.0M HCl solution
- (2014) Xinkuai He et al. CORROSION SCIENCE
- Role of 1,2,4-Triazole as a Passivating Agent for Cobalt during Post-Chemical Mechanical Planarization Cleaning
- (2014) Mingjie Zhong et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Synergetic effect of H2O2 and glycine on cobalt CMP in weakly alkaline slurry
- (2014) Liang Jiang et al. MICROELECTRONIC ENGINEERING
- Molecularly imprinted fluorescent and colorimetric sensor based on TiO2@Cu(OH)2 nanoparticle autocatalysis for protein recognition
- (2013) Yanxia Li et al. Journal of Materials Chemistry B
- The Effect of H2O2 and 2-MT on the Chemical Mechanical Polishing of Cobalt Adhesion Layer in Acid Slurry
- (2012) Hai-Sheng Lu et al. ELECTROCHEMICAL AND SOLID STATE LETTERS
- Unusual Spectroscopic and Ligand Binding Properties of the Cytochrome P450-Flavodoxin Fusion Enzyme XplA
- (2012) Soi H. Bui et al. JOURNAL OF BIOLOGICAL CHEMISTRY
- Cobalt Polishing with Reduced Galvanic Corrosion at Copper/Cobalt Interface Using Hydrogen Peroxide as an Oxidizer in Colloidal Silica-Based Slurries
- (2012) B. C. Peethala et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- The Effect of Glycine and Benzotriazole on Corrosion and Polishing Properties of Cobalt in Acid Slurry
- (2012) Hai-Sheng Lu et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Electrochemical behavior of potentiodynamically deposited cobalt oxyhydroxide (CoOOH) thin films for supercapacitor application
- (2012) A.D. Jagadale et al. MATERIALS RESEARCH BULLETIN
- CVD of cobalt–tungsten alloy film as a novel copper diffusion barrier
- (2012) Hideharu Shimizu et al. MICROELECTRONIC ENGINEERING
- Copper Oxide Nanoparticles: Synthesis, Characterization and Their Antibacterial Activity
- (2011) Sunita Jadhav et al. JOURNAL OF CLUSTER SCIENCE
- Facile growth of mesoporous Co3O4 nanowire arrays on Ni foam for high performance electrochemical capacitors
- (2011) Fang Zhang et al. JOURNAL OF POWER SOURCES
- Fundamental Study of Chemical–Mechanical Polishing Slurry of Cobalt Barrier Metal for the Next-Generation Interconnect Process
- (2010) Hideaki Nishizawa et al. JAPANESE JOURNAL OF APPLIED PHYSICS
- Synthesis of Nanorod-Shaped Cobalt Hydroxycarbonate and Oxide with the Mediation of Ethylene Glycol
- (2010) Xiaowei Xie et al. Journal of Physical Chemistry C
- Solubilization of poorly water-soluble drug carbamezapine in Pluronic® micelles: Effect of molecular characteristics, temperature and added salt on the solubilizing capacity
- (2009) Yogesh Kadam et al. COLLOIDS AND SURFACES B-BIOINTERFACES
- Chemical Mechanical Planarization of TaN Wafers Using Oxalic and Tartaric Acid Based Slurries
- (2009) S. V. S. B. Janjam et al. ELECTROCHEMICAL AND SOLID STATE LETTERS
- Electrochemical behavior of copper and cobalt in post-etch cleaning solutions
- (2009) S. Bilouk et al. MICROELECTRONIC ENGINEERING
- The effect of hydrogen peroxide on polishing removal rate in CMP with various abrasives
- (2008) R. Manivannan et al. APPLIED SURFACE SCIENCE
- Tartaric Acid as a Complexing Agent for Selective Removal of Tantalum and Copper in CMP
- (2008) S. V. S. B. Janjam et al. ELECTROCHEMICAL AND SOLID STATE LETTERS
- Synthesis and characterization of hybrid molecular material prepared by ionic liquid and silicotungstic acid
- (2008) T. Rajkumar et al. MATERIALS CHEMISTRY AND PHYSICS
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