4.7 Article

Numerical analysis, experimental verification and criterion establishment of non-magnetic microwave absorbing material

Journal

JOURNAL OF COLLOID AND INTERFACE SCIENCE
Volume 613, Issue -, Pages 256-264

Publisher

ACADEMIC PRESS INC ELSEVIER SCIENCE
DOI: 10.1016/j.jcis.2022.01.052

Keywords

Microwave absorption; Numerical analysis; Dielectric parameters; Non-magnetic materials

Funding

  1. National Natural Science Foundation of China [51772060, 51972078]
  2. Key Laboratory of Advanced Structural-Functional Integration Materials & Green Manufacturing Technology, Harbin Institute of Technology, Harbin, China

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Non-magnetic materials have great potential in microwave absorption, but analyzing the connection between performance and parameters is still challenging. This study simplifies and derives formulae, establishes criteria and fitting methods, and investigates the electromagnetic parameters for absorbing performance.
Non-magnetic materials show a great potentiality in microwave absorption with the advantages of low-density, wideband, and thin thickness. Even so, it is still difficult to accurately analyze the connection between performance and parameters. To reveal what electromagnetic parameters could lead to excellent absorbing performance, we simplify and derive the formulae based on Transmission-Reflection-Line theory (TRL) and computer programs. Based on the relation of epsilon' and epsilon '', a criterion is established to decide what parameters have the possibility of absorbing performance. Using a new fitting method, the relationship between dielectric constant and absorber content is established. Further, an instruction derived from the relation between e' and p is used to screen thicknesses. The optimum permittivity of ultra-low reflectivity and ultra-wide band is obtained by combining the numerical analysis results. To verify the accuracy and reliability of results and deductions, the permittivity of four prepared materials and fifty published papers are investigated. (C) 2022 Elsevier Inc. All rights reserved.

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