4.6 Article

Achieving low-thermal conductivity and high β phase in PVDF/PMMA blend foams via low-pressure microcellular foaming

Journal

JOURNAL OF APPLIED POLYMER SCIENCE
Volume 139, Issue 24, Pages -

Publisher

WILEY
DOI: 10.1002/app.52338

Keywords

beta phase; low pressure; polymethylmethacrylate; polyvinylidene fluoride; thermal conductivity

Funding

  1. Institute of Chinese Materia Medica, China Academy of Chinese Medical Sciences
  2. Peking Union Medical College [52003280]
  3. Natural Science Foundation of Jiangxi Province, [20212BAB203014]
  4. Natural Science Foundation of Shaanxi Provincial Department of Education [LQ21B040003]
  5. Program for Professor of Special Appointment (Eastern Scholar) at Shanghai Institutions of Higher Learning

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Microcellular PVDF foam with high expansion ratio and small cell size was successfully fabricated using polymethylmethacrylate (PMMA) additive and batch foaming method under mild processing conditions. The prepared PVDF/PMMA blend foam exhibited low thermal conductivity and high content of beta-phase crystal, showing promising applications in various fields.
Polyvinylidene fluoride (PVDF) foam exhibits wider applications than traditional foams such as polyethylene and polystyrene foams due to its good corrosion resistance, flame retardant and wide operating temperature range. However, PVDF is difficult to foam and rigorous operating conditions including high pressure and high temperature were unavoidably adopted to prepare PVDF foams. Herein, microcellular PVDF foam was successfully fabricated with the combination of adding polymethylmethacrylate (PMMA) and batch foaming at mild processing condition. Compared to the pure PVDF foam with a low-expansion-ratio of 1.1 times, the PVDF/PMMA (70/30) blend foam showed an expansion ratio as high as 20 times together with a small cell size of approximately 5 mu m. Additionally, the prepared PVDF/PMMA blend foam exhibited a low-thermal conductivity (0.039 w m(-1) k(-1)) and high content of beta-phase crystal (95%), which shows promising application in areas like electronic devices, thermal insulation and packaging materials.

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