Modulation of covalent bonded boron nitride/graphene and three-dimensional networks to achieve highly thermal conductivity for polymer-based thermal interfacial materials

Thermal interface materials (TIMs) with excellent comprehensive performance which own high thermal conductivity, good electrical insulation and mechanical properties have triggered considerable interests in addressing the interfacial transfer issue for the state-of-the-art electronic devices. Herein, a new method was developed to covalently bonded crosslink boron nitride (BN) and reduced graphene oxide (rGO) by the chemical surface modification technology and chemical reaction between the erent functional groups. Meanwhile, the integrated three-dimensional (3D) networks of BN-rGO filler and natural rubber (NR) matrix were fabricated by the ice-templated method. After vulcanization, the boron nitride-reduced graphene oxide/ natural rubber (BN-rGO/NR) TIMs owned good comprehensive performance. As a result, the highest through-plane thermal conductivity could reach 1.04 W m(-1) K-1 and also possessed sensitive response ability of heat flux. Importantly, the approach provided a valuable guidance to design TIMs with excellent comprehensive properties and owned promising applications in the thermal management of electronics.

Automated summary

In this study, a new method was developed to covalently bond boron nitride and reduced graphene oxide, resulting in thermal interface materials (TIMs) with excellent comprehensive performance. The TIMs exhibited high thermal conductivity, good electrical insulation, and mechanical properties, making them promising for thermal management in electronic devices.