4.8 Article

Self-Adhesive Dry Ionic Conductors Based on Supramolecular DeepEutectic Polymers

Journal

CHEMISTRY OF MATERIALS
Volume 34, Issue 8, Pages 3736-3743

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acs.chemmater.2c00074

Keywords

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Funding

  1. National Natural Science Foundation [51973065, 61973127]
  2. Natural Science Foundation of Guangdong Province [2020A1515011380]
  3. Science and Technology Program of Guangzhou [201904010330]
  4. Foundation of Shenzhen Science and Technology Innovation Committee [JCYJ20190809102407410]

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In this study, a self-adhesive dry ionic conductor (SADIC) was proposed, which is synthesized via in situ photopolymerization and exhibits high adhesion strength, transparency, tunable stretchability, and conductivity. It also shows excellent mechanical and electrical self-healing capabilities. This technology provides a promising strategy for improving device integration and enhancing the performance of flexible electronics.
Ionic conductors have promising applications in thefield offlexible electronics, but they usually suffer from weakbonding to substrates (<0.3 MPa), leading to large interfacialimpedances or detachment under repeated deformation. Here, asupramolecular deep eutectic polymer synthesized by in situphotopolymerization of a polymerizable deep eutectic solventmonomer is proposed as a self-adhesive dry ionic conductor(SADIC). The SADICs obtained are rich in dynamic hydrogenbonding and ions, which can instantly form various interfacialinteractions andfirmly adhere to substrates and maintain goodmechanical robustness. Notably, the maximum adhesion strength isup to similar to 3.5 MPa (on indium tin oxide (ITO) glass). Furthermore,the SADICs also show other comprehensive properties such ashigh transparency, tunable stretchability, favorable conductivity, and excellent mechanical and electrical self-healing capabilities. As ademonstration, the SADIC can be used as a durably self-adhesive ionic skin for volume change and deformation monitoring. Thesefindings provide a promising strategy for improving device integration and enhancing the performance offlexible electronics.

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