Numerical investigation of thermal performance of PCM based heat sink using structured porous media as thermal conductivity enhancers

Title
Numerical investigation of thermal performance of PCM based heat sink using structured porous media as thermal conductivity enhancers
Authors
Keywords
Phase change materials (PCM), Lattice frame materials (LFM), Thermal conductivity enhancers (TCE), Electronics cooling, Heat sink, Passive cooling
Journal
INTERNATIONAL JOURNAL OF THERMAL SCIENCES
Volume 104, Issue -, Pages 266-280
Publisher
Elsevier BV
Online
2016-04-27
DOI
10.1016/j.ijthermalsci.2016.01.008

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