Journal
JOURNAL OF SEMICONDUCTORS
Volume 42, Issue 12, Pages -Publisher
IOP Publishing Ltd
DOI: 10.1088/1674-4926/42/12/122804
Keywords
AlN; high temperature annealing; MOCVD
Categories
Funding
- Key-Area Research and Development Program of Guangdong Province [2019B121204004, 2019B010132001]
- Science Challenge Project [TZ2018003]
- Basic and Application Basic Research Foundation of Guangdong Province [2020A1515110891]
- National Natural Science Foundation of China [61734001, 61521004]
Ask authors/readers for more resources
This study successfully initialized a 4-inch crack-free high-quality AlN template using physical vapor deposition and high-temperature annealing, leading to the growth of a high-quality 700 nm thick AlN film. By avoiding the epitaxial lateral overgrowth process, this technology improves the manufacturing efficiency of UVC-LED and reduces costs.
In this work, based on physical vapor deposition and high-temperature annealing (HTA), the 4-inch crack-free high-quality AlN template is initialized. Benefiting from the crystal recrystallization during the HTA process, the FWHMs of X-ray rocking curves for (002) and (102) planes are encouragingly decreased to 62 and 282 arcsec, respectively. On such an AlN template, an ultra-thin AlN with a thickness of similar to 700 nm grown by MOCVD shows good quality, thus avoiding the epitaxial lateral overgrowth (FLOG) process in which 3-4 mu m AlN is essential to obtain the flat surface and high crystalline quality. The 4-inch scaled wafer provides an avenue to match UVC-LED with the fabrication process of traditional GaN-based blue LED, therefore significantly improving yields and decreasing cost.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available