Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions

Title
Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions
Authors
Keywords
Fused silica, Ductile mode grinding, High temperature nanoindentation, Material densification, Grinding temperature, Infrared radiation
Journal
Publisher
Elsevier BV
Online
2016-07-22
DOI
10.1016/j.ijmachtools.2016.07.007

Ask authors/readers for more resources

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search