Interconnected network of Ag and Cu in bioplastics for ultrahigh electromagnetic interference shielding efficiency with high thermal conductivity
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Title
Interconnected network of Ag and Cu in bioplastics for ultrahigh electromagnetic interference shielding efficiency with high thermal conductivity
Authors
Keywords
Poly (lactic acid), Metal double layer, Electromagnetic interference shielding, Thermal conductivity
Journal
COMPOSITES COMMUNICATIONS
Volume 30, Issue -, Pages 101093
Publisher
Elsevier BV
Online
2022-02-09
DOI
10.1016/j.coco.2022.101093
References
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