Effects of inclination angle and liquid subcooling on nucleate boiling on dimpled copper surfaces

Published 2016 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Effects of inclination angle and liquid subcooling on nucleate boiling on dimpled copper surfaces
Authors
Keywords
Dimpled Cu surfaces, PF-5060 dielectric liquid, Nucleate boiling, Immersion cooling of electronics, Critical heat flux, Liquid subcooling, Surface inclination angle
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 95, Issue -, Pages 650-661
Publisher
Elsevier BV
Online
2016-01-05
DOI
10.1016/j.ijheatmasstransfer.2015.12.048

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.