Analysis of critical thermal issues in 3D integrated circuits

Published 2016 View Full Article

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Title
Analysis of critical thermal issues in 3D integrated circuits
Authors
Keywords
3D integrated circuits, Thermal issues, Hot spots, Thermal management
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 97, Issue -, Pages 337-352
Publisher
Elsevier BV
Online
2016-02-28
DOI
10.1016/j.ijheatmasstransfer.2016.02.010

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