A Study on the Control of Residual Stress of Copper Thick-Film Using 2D Nanomaterial

Title
A Study on the Control of Residual Stress of Copper Thick-Film Using 2D Nanomaterial
Authors
Keywords
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Journal
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
Volume 21, Issue 12, Pages 5960-5964
Publisher
American Scientific Publishers
Online
2021-07-08
DOI
10.1166/jnn.2021.19512

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