Optimization of the Thermal Performance of Three-Dimensional Integrated Circuits (3D ICs) Utilizing Rectangular-Shaped and Disk-Shaped Heat Pipes

Published 2022 View Full Article

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Title
Optimization of the Thermal Performance of Three-Dimensional Integrated Circuits (3D ICs) Utilizing Rectangular-Shaped and Disk-Shaped Heat Pipes
Authors
Keywords
-
Journal
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
Volume -, Issue -, Pages -
Publisher
ASME International
Online
2022-02-11
DOI
10.1115/1.4053803

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