Laser-Induced Forward Transfer (LIFT) Technique as an Alternative for Assembly and Packaging of Electronic Components

Published 2021 View Full Article

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Title
Laser-Induced Forward Transfer (LIFT) Technique as an Alternative for Assembly and Packaging of Electronic Components
Authors
Keywords
-
Journal
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
Volume 27, Issue 6, Pages 1-8
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2021-05-28
DOI
10.1109/jstqe.2021.3084443

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