4.7 Article

High-performance and robust dual-function electrochromic device for dynamic thermal regulation and electromagnetic interference shielding

Journal

CHEMICAL ENGINEERING JOURNAL
Volume 422, Issue -, Pages -

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.cej.2021.130064

Keywords

Dual-function; EC device; MXene; PANI composites; EMI shielding and dynamic thermal management

Funding

  1. National Key Research & Development Program [2016YFE0201600,2016YFB0303903]

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This study presents a high-performance dual-function electrochromic device with superior EMI shielding effectiveness and dynamic thermal regulation performances, suitable for modern integrated electronic and telecommunication systems. The device, fabricated using various layers, demonstrates efficient conductive porous structure and excellent emittance modulation, allowing for dynamic heating or cooling.
High-performance devices with the electromagnetic interference (EMI) shielding and dynamic thermal regulation performances are highly desirable for modern integrated electronic and telecommunication systems in areas such as aerospace, communication equipment, and smart electronics. Herein, the dual-function electrochromic (EC) device is fabricated using the polyaniline (PANI) film as the infrared (IR) EC layer, the polymethyl methacrylate (PMMA) gel polymer as the electrolyte and the MXene/PANI/poly vinylidene fluoride (PVDF)/Au (MPPA) film as the EMI shielding layer. The device exhibits a superior EMI shielding effectiveness (SE) of 36.5 dB at 11.6 GHz, benefiting from the highly efficient conductive porous structure, as well as excellent dynamic thermal regulation performances by manipulating emittance (emittance modulation of 0.39 at 8-14 mu m), which could also achieve the dynamic heating or cooling of the practical object. Moreover, the performances of the device show no obvious degradation even under 650 cycles bending and 500 cycles twisting, indicating the high robustness. These results indicate that the dual-function device has promising potential for high-performance EMI shielding and thermal management applications.

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