Reinforcement of thermally-conductive SiC/Al composite with 3D-interpenetrated network structure by various SiC foam ceramic skeletons

Significant improvement of thermal conductivity for AlN/LAS composite with low thermal expansion

(2020) Zhenyu Li et al.   CERAMICS INTERNATIONAL

Three-dimensional network constructed by vertically oriented multilayer graphene and SiC nanowires for improving thermal conductivity and operating safety of epoxy composites with ultralow loading

(2020) Jing He et al.   COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

Highly compressible and anisotropic lamellar ceramic sponges with superior thermal insulation and acoustic absorption performances

(2020) Chao Jia et al.   Nature Communications

Fabrication of co-continuous SiC/Al composites from novel SiC preforms with high porosity and controllable pore size

(2020) Yicheng Jin et al.   CERAMICS INTERNATIONAL

Low thermal expansion coefficient and high thermal conductivity epoxy/Al2O3/T-ZnOw composites with dual-scale interpenetrating network structure

(2020) Binyong Wu et al.   COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

Enhanced thermal conductivity of epoxy composites by constructing aluminum nitride honeycomb reinforcements

(2020) Zhilei Wei et al.   COMPOSITES SCIENCE AND TECHNOLOGY

Experimental and numerical investigation of the effective thermal conductivity of MoSi2–RSiC composites with a three-dimensional interpenetrating network structure

(2020) Lei Cheng et al.   CERAMICS INTERNATIONAL

Polymer composites with expanded graphite network with superior thermal conductivity and electromagnetic interference shielding performance

(2020) Baojie Wei et al.   CHEMICAL ENGINEERING JOURNAL

High thermal conductivity and electrical insulation of liquid alloy/ceramic/epoxy composites through the construction of mutually independent structures

(2020) Si-Wei Xiong et al.   COMPOSITES SCIENCE AND TECHNOLOGY

A novel design of Al2O3-ZrO2 reticulated porous ceramics with hierarchical pore structures and excellent properties

(2019) Ruoyu Chen et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation

(2019) Jie Yuan et al.   ACS Applied Materials & Interfaces

Design of three-layered struts in SiC reticulated porous ceramics for porous burner

(2019) Xiong Liang et al.   CERAMICS INTERNATIONAL

Copper flake-coated cellulose scaffold to construct segregated network for enhancing thermal conductivity of epoxy composites

(2019) Vu Chi Doan et al.   COMPOSITES PART B-ENGINEERING

Preparation and anisotropic thermophysical properties of SiC honeycomb/Al-Mg-Si composite via spontaneous infiltration

(2019) Zhejian Zhang et al.   Progress in Natural Science-Materials International

Tunable coefficient of thermal expansion of Cu-B/diamond composites prepared by gas pressure infiltration

(2019) Guangzhu Bai et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Three dimensional porous alumina network for polymer composites with enhanced thermal conductivity

(2019) Chao Xiao et al.   COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

In-situ SiC reinforced Si-SiC 3D skeletons in SiC/Al-Si composites

(2019) Chongchong Wu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Thermal management and structural parameters optimization of MCM-BGA 3D package model

(2019) Liang Gong et al.   INTERNATIONAL JOURNAL OF THERMAL SCIENCES

Anisotropic thermal expansion behavior of an interpenetrating metal/ceramic composite

(2019) Siddhartha Roy et al.   THERMOCHIMICA ACTA

Interface design in 3D-SiC/Al-Si-Mg interpenetrating composite fabricated by pressureless infiltration

(2018) Dongmei Wang et al.   CERAMICS INTERNATIONAL

Temperature dependence of the mechanical and thermal expansion behaviors of MoSi 2 -RSiC composites with a three-dimensionally (3D) interpenetrated network structure

(2018) Peng-zhao Gao et al.   JOURNAL OF ALLOYS AND COMPOUNDS

High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging

(2018) Zhiyong Cai et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Enhanced thermal conductivity of epoxy composites filled with tetrapod-shaped ZnO

(2018) Liangchao Guo et al.   RSC Advances

Multimodal particle distribution in 3D-SiC/Al-Si-Mg interpenetrating composite fabricated by pressureless infiltration

(2018) Dongmei Wang et al.   CERAMICS INTERNATIONAL

Numerical analysis of novel SiC 3D /Al alloy co-continuous composites ventilated brake disc

(2017) X.D. Nong et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Vaporization and condensation in the Al 4 C 3 -SiC system

(2017) Hoang-Long Le-Tran et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies

(2017) Vincenzo d'Alessandro et al.   MICROELECTRONICS RELIABILITY

Silicon carbide-based foams derived from foamed SiC-filled phenolic resin by reactive infiltration of silicon

(2016) Shao-Chun Xu et al.   CERAMICS INTERNATIONAL

Microstructures and properties of Al–50%SiC composites for electronic packaging applications

(2016) Fei TENG et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA

Tuning pore structure of corrosion resistant solid-state-sintered SiC porous ceramics by particle size distribution and phase transformation

(2016) Wenming Guo et al.   MATERIALS & DESIGN

Simulation of damage and failure processes of interpenetrating SiC/Al composites subjected to dynamic compressive loading

(2014) Guoju Li et al.   ACTA MATERIALIA

Thermophysical properties of SiC/Al composites with three dimensional interpenetrating network structure

(2014) Shun Li et al.   CERAMICS INTERNATIONAL

Effect of recoating slurry compositions on the microstructure and properties of SiC reticulated porous ceramics

(2013) Xiumin Yao et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

(2013) Chandramouli Subramaniam et al.   Nanoscale

Processing of Al/SiC composites in continuous solid–liquid co-existent state by SPS and their thermal properties

(2012) Kiyoshi Mizuuchi et al.   COMPOSITES PART B-ENGINEERING

Microstructure and properties of Al/Si/SiC composites for electronic packaging

(2012) Xiao-min ZHU et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA

Production and characterization of a three-dimensional cellular metal-filled ceramic composite

(2010) D. Cree et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Improving the properties of ceramic foams by a vacuum infiltration process

(2010) U.F. Vogt et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Net-shape forming and properties of high volume fraction SiCp/Al composites

(2009) Shubin Ren et al.   JOURNAL OF ALLOYS AND COMPOUNDS