Thermodynamic descriptions of the binary Ni–Sn and ternary Cu–Ni–Sn systems over entire composition range: A revisit

Thermodynamic descriptions of quaternary Mg–Al–Zn–Bi system supported by experiments and their application in descriptions of solidification behavior in Bi-additional AZ casting alloys

(2020) Ying Tang et al.   Journal of Magnesium and Alloys

Critical review of phase equilibria in the Ni-Si-Zn ternary system and its thermodynamic description supported by first-principles calculations

(2019) Ying Tang et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

Effect of Ni Content on Microstructure and Characterization of Cu-Ni-Sn Alloys

(2018) Sanming Du et al.   Materials

Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications

(2018) Hector M. Henao et al.   METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE

The Open Quantum Materials Database (OQMD): assessing the accuracy of DFT formation energies

(2015) Scott Kirklin et al.   npj Computational Materials

Thermodynamic reassessment of Au–Cu–Sn ternary system

(2013) H.Q. Dong et al.   JOURNAL OF ALLOYS AND COMPOUNDS

The Cu–Sn phase diagram part II: New thermodynamic assessment

(2012) D. Li et al.   INTERMETALLICS

The Cu–Sn phase diagram, Part I: New experimental results

(2012) S. Fürtauer et al.   INTERMETALLICS

Thermodynamic re-assessment of the Ni – Sn system

(2012) Jinming Liu et al.   International Journal of Materials Research

Theoretical assessment of the Ni–Sn system

(2012) Adela Zemanova et al.   MONATSHEFTE FUR CHEMIE

Experimental investigation and thermodynamic assessment of the Cu–Sn–Ti ternary system

(2011) Jiang Wang et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

An overview on phase equilibria and thermodynamic modeling in multicomponent Al alloys: Focusing on the Al–Cu–Fe–Mg–Mn–Ni–Si–Zn system

(2011) Yong Du et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

Thermodynamic optimization of the Cu–Sn and Cu–Nb–Sn systems

(2008) Mei Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Cu-Ni-Sn: A Key System for Lead-Free Soldering

(2008) C. Schmetterer et al.   JOURNAL OF ELECTRONIC MATERIALS

Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations

(2008) V. Vuorinen et al.   JOURNAL OF ELECTRONIC MATERIALS