Wireless Inter/Intra-Chip Communication Using an Innovative PCB Channel Bounded by a Metamaterial Absorber

Title
Wireless Inter/Intra-Chip Communication Using an Innovative PCB Channel Bounded by a Metamaterial Absorber
Authors
Keywords
-
Journal
IEEE Antennas and Wireless Propagation Letters
Volume 15, Issue -, Pages 1634-1637
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2016-01-26
DOI
10.1109/lawp.2016.2519923

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