Journal
HIGH PERFORMANCE POLYMERS
Volume 29, Issue 3, Pages 298-304Publisher
SAGE PUBLICATIONS LTD
DOI: 10.1177/0954008316642278
Keywords
Bismaleimide; resin transfer molding; low cure temperature
Categories
Funding
- Youth Science Foundation of Heilongjiang Province, China [QC2014C008]
- Science Foundation of Heilongjiang Academy of Sciences [2015-YQ-01]
Ask authors/readers for more resources
High-performance bismaleimide resin systems (here coined LBMI resin series) based on 4,4-bismaleimidodiphenylmethane, 2,4-bismaleimidotoluene, bisphenol A bisallyl ether, 4,4-bis[2-(1-propenyl)phenoxy]benzophenone, 2-allylphenol, and cumene hydroperoxide for resin transfer molding (RTM) process with low cure and post-cure temperatures (180 degrees C) have been developed. Considering the optimum formulation conditions, the injection temperature is in the range of 70-160 degrees C, and the pot life at 100 degrees C is determined to be approximately 100 min. After curing at 180 degrees C for 6 h, the resins exhibit high thermal resistances, excellent mechanical properties, and exceptionally low dielectric loss. Among others, these findings render the materials suitable for the use as high-performance resins for the production of advanced composites via RTM technique and with low cure temperatures.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available