Mechanical behaviors of graphene/copper matrix composite foils fabricated by pulse electrodeposition

Advances in synthesizing copper/graphene composite material

(2016) Lei Zhang et al.   MATERIALS AND MANUFACTURING PROCESSES

Thermal conductivity of graphene with defects induced by electron beam irradiation

(2016) Hoda Malekpour et al.   Nanoscale

Preparation and mechanical property of electrodeposited Al-graphene composite coating

(2016) Na Li et al.   MATERIALS & DESIGN

Microstructure and corrosion behavior of Ti nanoparticles reinforced Ni–Ti composite coatings by electrodeposition

(2015) Yuantao Zhao et al.   MATERIALS & DESIGN

Enhanced Reduction of Graphene Oxide on Recyclable Cu Foils to Fabricate Graphene Films with Superior Thermal Conductivity

(2015) Sheng-Yun Huang et al.   Scientific Reports

Effect of ball milling on graphene reinforced Al6061 composite fabricated by semi-solid sintering

(2014) Mina Bastwros et al.   COMPOSITES PART B-ENGINEERING

Improved microstructure and mechanical properties in gas tungsten arc welded aluminum joints by using graphene nanosheets/aluminum composite filler wires

(2014) M. Fattahi et al.   MICRON

A study on electrodeposition of Ni-noncovalnetly treated carbon nanotubes nanocomposite coatings with desirable mechanical and anti-corrosion properties

(2014) Farhad Daneshvar-Fatah et al.   SURFACE & COATINGS TECHNOLOGY

Enhanced Mechanical Properties of Graphene/Copper Nanocomposites Using a Molecular-Level Mixing Process

(2013) Jaewon Hwang et al.   ADVANCED MATERIALS

Enhanced strength in bulk graphene-copper composites

(2013) Ke Chu et al.   PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE

Electrodeposition and properties of Zn–Ni–CNT composite coatings

(2009) B.M. Praveen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Raman spectroscopy of graphene on different substrates and influence of defects

(2008) Anindya Das et al.   BULLETIN OF MATERIALS SCIENCE

Measurement of the Elastic Properties and Intrinsic Strength of Monolayer Graphene

(2008) C. Lee et al.   SCIENCE