Significance of haphazard motion and thermal migration of alumina and copper nanoparticles across the dynamics of water and ethylene glycol on a convectively heated surface

Sequel to all the published facts on the dynamics of water and ethylene glycol on a convectively heated surface conveying alumina and copper nanoparticles as applicable in engineering and industry, noting is known on the significance of haphazard motion and thermo-migration. For the case of Al2O3/Cu nanoparticles, the governing equations that model the transport phenomena along a vertical surface were non-dimensionalized. The obtained dimensionless equation (ODE BVP) was numerically solved in MATLAB using the text bvp4c in-built solver. The temperature distribution is minimal when convectively heating at the horizontal wall beneath the transport phenomenon is small in magnitude. When Biot number and thermo-migration are high, and the base fluid is less thick, there is minimal friction between the wall and the last layer of hybrid nanofluid due to increasing haphazard motion of alumina/copper nanoparticles (i.e., water). Heating of the base fluid is a factor for reducing friction as water is heated faster due to lower density than ethylene glycol.

Automated summary

This study investigates the impact of haphazard motion of alumina and copper nanoparticles on temperature distribution and thermo-migration under the phenomenon of transport along a vertical surface. The results show that at high Biot numbers and thermo-migration, with a less thick base fluid, the heat conduction of water exceeds that of ethylene glycol.