Thermal and Dielectric Properties of Cyanate Ester Cured Main Chain Rigid-Rod Epoxy Resin

Thermal and dielectric properties of rigid-rod bifunctional epoxy resin 4,4-bis(2,3-epoxypropoxy) biphenyl epoxy (BP) and commercial epoxy resin diglycidyl ether of bisphenol A (DGEBA) were studied using differential scanning calorimeter (DSC), thermogravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermal mechanical analyzer (TMA) and dielectric analyzer (DEA). These two epoxies were cured with cyanate ester hardener 2,2'-bis(4-cyanatophenyl) propane (AroCy B10). The BP/B10 system consisting of a rigid-rod structure exhibited better thermal properties than the DGEBA/B10 system with a flexible structure. Anisotropic BP/B10 (2:1) had the highest 5% weight loss temperature, the highest amount of residue and a smaller thermal expansion coefficient than the commercial DGEBA/B10 system. The BP/B10 system, which cured at the LC phase temperature, had higher Tg than the commercial DGEBA/B10 system, as found from dynamic mechanical analysis. The BP/B10 system also demonstrated better dielectric properties than the commercial DGEBA/B10 system when enough curing agent was provided.

Automated summary

The study compared the thermal and dielectric properties of rigid-rod bifunctional epoxy resin and commercial epoxy resin, finding that the rigid-rod structure exhibited better performance with higher 5% weight loss temperature and smaller thermal expansion coefficient than the flexible structure. Additionally, the rigid-rod system demonstrated higher Tg and better dielectric properties when enough curing agent was provided.