An addition-curable hybrid phenolic resin containing silicon and boron with improved thermal stability

In this work, an addition-curable hybrid phenolic resin containing silicon and boron was synthesized via the addition-condensation reaction between 4-hydroxyphenylboronic acid and formaldehyde to obtain boron hybrid novolac resin (BN), which was followed by esterification with vinyltrimethoxysilane. Boron and silicon were introduced into the phenolic resin skeleton by forming C-B-OH, B-O-C, B-O-Si, and Si-O-Ph bonds, so the hybrid resin not only realized uniform molecular-level dispersion of hybrid elements but also achieved addition curing via the presence of vinyl groups. The hybrid resin's residual weight in an N-2 atmosphere at 800 degrees C was improved to 81.02%. The high residual weight arose from the formation of a three-dimensional continuous oxide framework composed of B-O-B-O-Si-O-Si. In addition, we characterized the pyrosis production of the materials with the combination of FT-IR, Raman, SEM/SEM-EDX, XPS, and solid-state NMR spectroscopy to develop a detailed understanding of the synergistic effects of boron-silicon modified phenolic resin. (C) 2021 Elsevier Ltd. All rights reserved.

Automated summary

In this study, a hybrid phenolic resin containing silicon and boron was synthesized through addition-condensation reactions, resulting in improved residual weight at high temperatures. The hybrid resin achieved uniform dispersion of hybrid elements at the molecular level and addition curing via the presence of vinyl groups. Characterization using multiple techniques provided a detailed understanding of the synergistic effects of boron-silicon modified phenolic resin.