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(2017) Fuliang Wang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of Bis-(3-sulfopropyl) Disulfide and Chloride Ions on the Localized Electrochemical Deposition of Copper Microstructures

(2017) Fuliang Wang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of Voltage and Gap on Micro-Nickel-Column Growth Patterns in Localized Electrochemical Deposition

(2017) Fuliang Wang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Parametric Electrochemical Deposition of Controllable Morphology of Copper Micro-Columns

(2016) Fuliang Wang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columns

(2016) Fuliang Wang et al.   Scientific Reports

Electrodeposition of hierarchical Ag on nanoporous GaN and its surface enhanced Raman scattering application

(2015) Yu Zhao et al.   MATERIALS LETTERS

Au nanoparticle-decorated porous gallium nitride as an ultrasensitive substrate for surface enhanced Raman spectroscopy

(2014) Feng-Xiang Deng et al.   RSC Advances

The effect of saccharine on the localized electrochemical deposition of Cu-rich Cu–Ni microcolumns

(2011) S. Pané et al.   ELECTROCHEMISTRY COMMUNICATIONS

Localized electrochemical deposition of micrometer copper columns by pulse plating

(2009) J.C. Lin et al.   ELECTROCHIMICA ACTA

Localized Ni deposition improved by saccharin sodium in the intermittent MAGE process

(2009) J H Yang et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Localized electrochemical deposition process improvement by using different anodes and deposition directions

(2008) Chun-Ying Lee et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING