4.6 Article

Hot Deformation Behavior and Recrystallization Mechanism in an As-Cast CoNi-Based Superalloy

Journal

METALS AND MATERIALS INTERNATIONAL
Volume 28, Issue 6, Pages 1488-1498

Publisher

KOREAN INST METALS MATERIALS
DOI: 10.1007/s12540-021-01017-3

Keywords

CoNi-based superalloy; Hot deformation; Processing map; Recrystallization mechanism

Funding

  1. National Key R&D Program of China [2017YFB0702901]
  2. National Natural Science Foundation of China [51474156, 51604193, U1660201]
  3. National High Technology Research and Development Program of China [2015AA042504]

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The hot deformation behavior and microstructure evolution of as-cast CoNi-based superalloy were investigated through hot compression tests, revealing a peak efficiency of 0.38 on the processing map at 1130 degrees C and a strain rate of 0.01 s(-1). The dominant recrystallization mechanism during hot working was found to be discontinuous dynamic recrystallization (DDRX) related to strain-induced grain boundary migration (SIBM), with additional recrystallization occurring through sub-grains around MC carbides and shear band formations. The presence of fine gamma ' precipitates was also noted to inhibit recrystallization.
The hot deformation behavior of as-cast CoNi-based superalloy was investigated by means of hot compression tests. The corresponding microstructure evolution after hot deformation was examined by optical microscope, as well as the TEM technique. The constitutive equation and processing map as a function of deformation temperature and strain rate were developed. Results show that the efficiency peak of the processing map is 0.38 at the temperature of 1130 degrees C and the strain rate of 0.01 s(-1). The discontinuous dynamic recrystallization (DDRX) related to the strain-induced grain boundary migration (SIBM) is the dominant recrystallization mechanism during hot working. Meanwhile, the DRX also occurs by forming sub-grains around MC carbides and shear band. In addition, the existence of fine gamma ' precipitates are found to retard the recrystallization. Graphic Abstract

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