Viscoelastic model to capture residual stresses in heat cured dissimilar adhesive bonded joints

Experimental methods to capture curing induced effects in adhesive bonded joints

(2020) Akshat Agha et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Viscoelastic behavior of an epoxy resin during cure below the glass transition temperature: Characterization and modeling

(2018) Alice Courtois et al.   JOURNAL OF COMPOSITE MATERIALS

Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive

(2018) Chengkun Ma et al.   Materials

Isothermal curing kinetics of a flame retardant epoxy resin containing DOPO investigated by DSC and rheology

(2016) Jianhua Hu et al.   THERMOCHIMICA ACTA

Adhesive Joints for Low- and High-Temperature Use: An Overview

(2014) E. A. S. Marques et al.   The Journal of Adhesion

Analysing process-induced deformation and stresses using a simulated manufacturing process for composite multispar flaps

(2014) Christian Brauner et al.   JOURNAL OF COMPOSITE MATERIALS

Influence of the curing process on joint strength of a toughened heat-curing adhesive

(2014) G. Meschut et al.   Welding in the World

Cure shrinkage characterization of an epoxy resin system by two in situ measurement methods

(2009) Loleï Khoun et al.   POLYMER COMPOSITES

Curing kinetics and mechanisms of polysulfone nanofibrous membranes toughened epoxy/amine systems using isothermal DSC and NIR

(2009) Gang Li et al.   THERMOCHIMICA ACTA

A small-strain model to simulate the curing of thermosets

(2008) M. Hossain et al.   COMPUTATIONAL MECHANICS

Analytical models of adhesively bonded joints—Part II: Comparative study

(2008) Lucas F.M. da Silva et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC

(2008) Hongyang Cai et al.   THERMOCHIMICA ACTA