4.3 Article

Temperature-sensitive spatial distribution of defects in PdSe2 flakes

Journal

PHYSICAL REVIEW MATERIALS
Volume 5, Issue 4, Pages -

Publisher

AMER PHYSICAL SOC
DOI: 10.1103/PhysRevMaterials.5.L041001

Keywords

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Funding

  1. National Natural Science Foundation of China [61625402, 62034004, 61921005, 61974176, 12074176]
  2. Collaborative Innovation Center of Advanced Microstructures
  3. Natural Science Foundation of Jiangsu Province [BK20190276, BK20180330]
  4. Fundamental Research Funds for the Central Universities [020414380084]

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This study investigates the temperature-sensitive spatial redistribution of defects in PdSe2 thin flakes using scanning tunneling microscopy. Results show that defects exhibit strong anisotropic characteristics at 80K, which weaken as temperature increases. Additionally, temperature also affects the anisotropic features of carrier mobility and phase coherent length in PdSe2 thin flakes.
Defect engineering plays an important role in tailoring the electronic transport properties of van der Waals materials. However, it is usually achieved through tuning the type and concentration of defects, rather than dynamically reconfiguring their spatial distribution. Here, we report temperature-sensitive spatial redistribution of defects in PdSe2 thin flakes through scanning tunneling microscopy. We observe that the spatial distribution of Se vacancies in PdSe2 flakes exhibits a strong anisotropic characteristic at 80 K, and that this orientation-dependent feature is weakened when temperature is raised. Moreover, we carry out transport measurements on PdSe2 thin flakes and show that the anisotropic features of carrier mobility and phase coherent length are also sensitive to temperature. Combining with theoretical analysis, we conclude that temperature-driven defect spatial redistribution could interpret the temperature-sensitive electrical transport behaviors in PdSe2 thin flakes. Our work highlights that engineering spatial distribution of defects in the van der Waals materials, which has been overlooked before, may open up an avenue to tailor the physical properties of materials and explore different device functionalities.

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