Synthesis and Thermal Degradation Study of Polyhedral Oligomeric Silsesquioxane (POSS) Modified Phenolic Resin

In this paper, a new polyhedral oligomeric silsesquioxane containing a phenol group (POSS-Phenol) is prepared through the Michael addition reaction, which is added to the synthesis of phenolic resin as a functional monomer. Infrared spectroscopy (IR) is used to demonstrate the chemistry structure of the synthesized POSS modified phenolic resin. After introducing POSS into the resole, a comprehensive study is conducted to reveal the effects of POSS on the thermal degradation of phenolic resin. First, thermal degradation behaviors of neat phenolic resin and modified phenolic resin are carried out by thermogravimetric analysis (TGA). Then, the gas volatiles from thermal degradation are investigated by thermogravimetric mass spectrometry (TG-MS). Finally, the residues after thermal degradation are characterized by X-ray diffraction (XRD). The research indicates that POSS modified phenolic resin shows a better thermal stability than neat phenolic resin, especially at high temperatures under air atmosphere. On the one hand, the introduction of the POSS group can effectively improve the release temperature of oxygen containing volatiles. On the other hand, the POSS group forms silica at high temperatures under air, which can effectively inhibit the thermal oxidation of phenolic resin and make phenolic resin show a better high-temperature oxidation resistance.

Automated summary

A new POSS-Phenol was synthesized and its effects on the thermal degradation of phenolic resin were investigated. The study found that POSS modified phenolic resin exhibited better thermal stability at high temperatures.