Bioleaching of Copper-Containing Electroplating Sludge

Title
Bioleaching of Copper-Containing Electroplating Sludge
Authors
Keywords
Copper-containing electroplating sludge, Microbial consortium, Copper extraction, Leaching mechanism, TCLP test
Journal
JOURNAL OF ENVIRONMENTAL MANAGEMENT
Volume 285, Issue -, Pages 112133
Publisher
Elsevier BV
Online
2021-02-17
DOI
10.1016/j.jenvman.2021.112133

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