Interface design and dielectric response behavior of SiO2/PB composites with low dielectric constant and ultra-low dielectric loss

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

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Low fractal dimension modified drilling‐hole wall for PTFE high‐frequency board copper plating with plasma treatment

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Symmetrical “Sandwich” Polybutadiene Film with High-Frequency Low Dielectric Constants, Ultralow Dielectric Loss, and High Adhesive Strength

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Effects of particle size distribution of silica on properties of PTFE/SiO2 composites

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Impact of the phenyl thioether contents on the high frequency dielectric loss characteristics of the modified polyimide films

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Novel high-performance poly(benzoxazole-co-imide) resins with low dielectric constants and superior thermal stabilities derived from thermal rearrangement of ortho-hydroxy polyimide oligomers

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Segmental dynamics in interfacial region of composite materials

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Exploring Strategies for High Dielectric Constant and Low Loss Polymer Dielectrics

(2014) Lei Zhu   Journal of Physical Chemistry Letters

Dielectric Properties of Polymer–Particle Nanocomposites Influenced by Electronic Nature of Filler Surfaces

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Adhesive and dielectric properties of novel polyimides with bis(3,3′-aminophenyl)-2,3,5,6-tetrafluoro-4-trifluoromethyl phenyl phosphine oxide (mDA7FPPO)

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Adhesion of polymers

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Dense SiOC cap for damage-less ultra low k integration with direct CMP in C45 architecture and beyond

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