Migration kinetics of twinning disconnections in nanotwinned Cu: An in situ HRTEM deformation study
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Title
Migration kinetics of twinning disconnections in nanotwinned Cu: An in situ HRTEM deformation study
Authors
Keywords
in situ, TEM, twin boundaries, Twinning disconnections, Serrated boundaries
Journal
SCRIPTA MATERIALIA
Volume 194, Issue -, Pages 113621
Publisher
Elsevier BV
Online
2020-12-31
DOI
10.1016/j.scriptamat.2020.11.006
References
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Related references
Note: Only part of the references are listed.- Three-dimensional character of the deformation twin in magnesium
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- Growth Twins and Deformation Twins in Metals
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- Physics and model of strengthening by parallel stacking faults
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- Twinning and De-twinning via Glide and Climb of Twinning Dislocations along Serrated Coherent Twin Boundaries in Hexagonal-close-packed Metals
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- Twinning dislocation multiplication at a coherent twin boundary
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- (2010) Y.T. Zhu et al. ACTA MATERIALIA
- (1¯012) Twinning nucleation mechanisms in hexagonal-close-packed crystals
- (2009) J. Wang et al. ACTA MATERIALIA
- Orientation dependence of shock-induced twinning and substructures in a copper bicrystal
- (2009) Fang Cao et al. ACTA MATERIALIA
- Plastic flow stability of nanotwinned Cu foils
- (2009) O. Anderoglu et al. INTERNATIONAL JOURNAL OF PLASTICITY
- Revealing the Maximum Strength in Nanotwinned Copper
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- Epitaxial nanotwinned Cu films with high strength and high conductivity
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- Thermal stability of sputtered Cu films with nanoscale growth twins
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