Role of layer order on the equi-biaxial behavior of Al/Mo bilayers

Determining effective crack lengths from electrical measurements in polymer-supported thin films

(2020) O. Glushko et al.   THIN SOLID FILMS

Strain ratio effects in mechanical properties of supported thin films

(2020) P. Godard et al.   JOURNAL OF APPLIED PHYSICS

Analysis of the multi-cracking mechanism of brittle thin films on elastic-plastic substrates

(2019) I. Ben Cheikh et al.   INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

Strain transfer through film-substrate interface and surface curvature evolution during a tensile test

(2018) Wei He et al.   APPLIED SURFACE SCIENCE

Two-stage cracking of metallic bi-layers on polymer substrates under tension

(2018) B. Putz et al.   SCRIPTA MATERIALIA

In-situ observations of the fracture and adhesion of Cu/Nb multilayers on polyimide substrates

(2018) M.J. Cordill et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Electro-mechanical behavior of Al/Mo bilayers studied with in situ straining methods

(2018) Patrice Kreiml et al.   THIN SOLID FILMS

In situ x-ray diffraction analysis of 2D crack patterning in thin films

(2018) D. Faurie et al.   ACTA MATERIALIA

Thickness dependence of the electro-mechanical response of sputter-deposited Mo thin films on polyimide: Insights from in situ synchrotron diffraction tensile tests

(2017) Tanja Jörg et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Influence of extreme thermal cycling on metal-polymer interfaces

(2017) Barbara Putz et al.   MICROELECTRONIC ENGINEERING

Effect of Microstructure on the Electro-Mechanical Behaviour of Cu Films on Polyimide

(2016) J. Berger et al.   JOM

The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model

(2015) Vera M. Marx et al.   ACTA MATERIALIA

Improved electro-mechanical performance of gold films on polyimide without adhesion layers

(2015) Barbara Putz et al.   SCRIPTA MATERIALIA

Load Sharing Phenomena in Nanoscale Cu/Nb Multilayers

(2014) Mikhail N. Polyakov et al.   ADVANCED ENGINEERING MATERIALS

Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain

(2014) O. Glushko et al.   THIN SOLID FILMS

In situmonitoring of X-ray strain pole figures of a biaxially deformed ultra-thin film on a flexible substrate

(2014) G. Geandier et al.   JOURNAL OF APPLIED CRYSTALLOGRAPHY

Yield surface of polycrystalline thin films as revealed by non-equibiaxial loadings at small deformation

(2013) S. Djaziri et al.   ACTA MATERIALIA

Correlation between full width at half maximum (FWHM) of XRD peak with residual stress on ground surfaces

(2012) M. Vashista et al.   PHILOSOPHICAL MAGAZINE

Deformation mechanisms in nanocrystalline metals: Insights from in-situ diffraction and crystal plasticity modelling

(2012) S. Van Petegem et al.   THIN SOLID FILMS

Combined synchrotron X-ray and image-correlation analyses of biaxially deformed W/Cu nanocomposite thin films on Kapton

(2011) Soundes Djaziri et al.   JOURNAL OF APPLIED CRYSTALLOGRAPHY

In situ x-ray investigation of freestanding nanoscale Cu–Nb multilayers under tensile load

(2009) C. C. Aydıner et al.   APPLIED PHYSICS LETTERS

Size effects on yield strength and strain hardening for ultra-thin Cu films with and without passivation: A study by synchrotron and bulge test techniques

(2008) Patric A. Gruber et al.   ACTA MATERIALIA

Strong single-crystalline Au films tested by a new synchrotron technique

(2008) Patric A. Gruber et al.   ACTA MATERIALIA

Tensile behavior of 40nm Cu/Nb nanoscale multilayers

(2008) N.A. Mara et al.   SCRIPTA MATERIALIA