Enhanced catalytic performance in low-temperature NH3-SCR process of spherical MCM-41 modified with Cu by template ion-exchange and ammonia treatment

Spherical MCM-41 (S-MCM-41) was synthesised and used as support for deposition of copper by template ionexchange (TIE) method using CuCl2 solutions. Another series of catalysts was prepared by modified TIE procedure, including treatment of S-MCM-41, directly after TIE, with ammonia solution (TIE-NH3). The samples were characterized with respect to chemical composition (ICP-OES), texture (N-2 -sorption), structure (XRD, FTIR), morphology and surface composition (SEM-EDS), aggregation of copper species (UV-vis-DRS), reducibility (H-2-TPR) and surface acidity (NH3-TPD). It was shown that deposition of copper by TIE method resulted in samples containing simultaneously highly dispersed copper species as well as CuO nanorods. The TIE-NH3 procedure resulted in deposition of highly dispersed copper species located mainly inside pores without formation of CuO crystallites. The samples obtained by TIE-NH3 method were found to be very promising catalysts for the low-temperature NH3-SCR process, possibly due to the presence of large number of highly dispersed copper species, deposited on the large surface area of S-MCM-41.

Automated summary

Deposition of copper by TIE method results in samples containing highly dispersed copper species and CuO nanorods, while deposition of highly dispersed copper species inside pores can be achieved through the TIE-NH3 procedure. Samples obtained by TIE-NH3 method are found to be promising catalysts for low-temperature NH3-SCR process.